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IO-Link qualification

IO-Link qualification

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Hefei Onsoon Intelligent Electronics Co., Ltd. was founded in 2011. It is a national high-tech enterprise whose main business is the development and promotion of IO-Link technology. The company's business scope includes: IO-Link software and hardware tool development, IO-Link solution development and IO-Link testing services.

The company is a member of several industrial communication associations such as PI, EtherCAT, ODVA, CC-Link, and IO-Link. The company passed the IO-Link Competency Center certification twice in 2019 and 2021, and is the first IO-Link Competence Center (IOL-CC) in China. In March 2023, the company passed the audit of the IO-Link Association and became the third test center (IOL-TC) in the world and the first in Asia.

Introduction to IO-Link test content

Introduction to IO-Link test content

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Master test

In order to use the IO-Link logos and image trademarks, the IO-Link Community requires that each IO-Link Master placed on the market must submit a manufacturer's declaration confirming the successful completion of prescribed compliance tests.

01

Master protocol test:

Executive standards: Chapter 8 in "IO-Link Test Specification Version 1.1.3"
Test content: Timings, Process Data (PD), On-request Data (OD), STARTUP, PREOPERATE, OPERATE, Fallback, Retry, ISDU – Application ErrorTypes
, ISDU – Derived ErrorTypes
, ISDU – Limit checks, Events, Data Storage (DS), and Legacy Device ("V1.0")

02

Master physical layer test:

Executive standards:Chapter 5 in "IO-Link Test Specification Version 1.1.3"
Test content: The physical layer tests comprise a visual inspection of the type of connector, cable, maximum cable length and color coding of the wires. Also measurements of voltage levels and currents as well as timing limits, slopes and line and message signals.

03

Master EMC test:

Execution standards:Annex H in "IO-Link Interface and System Specification Version 1.1.3"

Test content: Electrostatic discharges (ESD) IEC 61000-4-2, Radiofrequency electromagnetic field. Amplitude modulated
IEC 61000-4-3, Fast transients (Burst) IEC 61000-4-4,Radio-frequency common mode IEC 61000-4-6.

Device test

In order to use the IO-Link logos and image trademarks, the IO-Link Community requires that each IO-Link Device placed on the market must submit a manufacturer's declaration confirming the successful completion of prescribed compliance tests.

01

Device IODD test:

Executive standards:Chapter 7 of "IO-Link Test Specification Version 1.1.3"
Test content:IODD file, parameter verification test in IODD, system functions defined in IODD

02

Device protocol test:

Executive standards:Chapter 6 in "IO-Link Test Specification Version 1.1.3"
Test content:STARTUP, PREOPERATE,

OPERATE, ISDU, Events, Data Storage (DS)
, Operation with a legacy Master ("Master 1.0"), Direct Parameter page 1, Predefined Device parameters, Block parameter

03

Device physical layer test:

Executive standards:Chapter 5 in "IO-Link Test Specification Version 1.1.3"
Test content:The physical layer tests comprise a visual inspection of the type of connector, cable, maximum cable length and color coding of the wires. Also measurements of voltage levels and currents as well as timing limits, slopes and line and message signals.

04

Device EMC test:

Executive standards:Annex H in "IO-Link Interface and System Specification Version 1.1.3"
Test content:Electrostatic discharges (ESD) IEC 61000-4-2, Radiofrequency electromagnetic field. Amplitude modulated IEC 61000-4-3, Fast transients (Burst) IEC 61000-4-4,Radio-frequency common mode IEC 61000-4-6.

IO-Link test service process

IO-Link test service process

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IO-Link product testing process

IO-link产品测试流程

IO-Link test service item sample form

IO-Link master test
Test project Protocol Test EMC Test Physical layer testing
Prototype preparation 1. One prototype, with TCP/IP test interface and standard SMI command;
2. Provide TCP/IP address: (Example: 192.168.0.2);
3. Provide TCP/IP port number: (preferred: 49850).
1. 3-4 prototypes;
2. The master station is set in EMC test mode: the master station must copy the input process data of any device message received to the output process data of the next master station message to be sent.
1. 1 prototype and 1 product manual.
IO-Link device testing
Test project Protocol Test EMC Test Physical layer testing
Prototype preparation 1. 1 prototype;
2. 1 copy of IODD file and 1 copy of product manual;
3. To provide "Parameter Set 1" and "Parameter Set 2", the following conditions must be met:
1) "Parameter Set 1" and "Parameter Set 2" contain the parameters listed in the data store;
2) The data storage parameters of "Parameter Set 1" and "Parameter Set 2" are different;
3) "Parameter set 1" is inconsistent with the delivered equipment parameter set;
4. Provide the event code and event type of test event A and event B defined in config7;
5. Provide the startup time required for the device after the device is reset or powered off and restarted;
6. If the device supports local parameterization, it needs to provide a local parameterization index and provide instructions on how to operate it;
7. If the device supports error counting, provide the method and documentation for triggering errors;
8. If the device supports index 21, provide the device serial number;
9. If the device supports index 22, provide the device hardware version number;
10. If the device supports index 23, provide the device firmware version number;
11. If the device supports PDOut and needs to be set to enable PDOut, provide the index, sub-index, and value of the setting parameters;
12. If the device supports firmware upgrade profile, provide the device firmware upgrade file and password.
1. 3-4 prototypes 1. 1 prototype and 1 product manual;
2. How to set the maximum power consumption in SIO mode and documentation;
3. How to set the maximum power consumption in IO-Link mode and documentation;
3. High-level input threshold voltage at C/Q, VID1 (VSD=18V), VID2 (VSD=30V)
4. Low-level input threshold voltage at C/Q, VID1 (VSD=18V), VID2 (VSD=30V)

 Test Center Contact Information:  Li Gang     Tel:15365121982   E-mail:ligang@onsoon.cn

IO-Link test tool

IO-Link test tool

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Master protocol testing tool


Test the protocol compatibility of the IO-Link Master and support all Master protocol test cases in the "IO-Link Test Specification Version 1.1.3". Use TCP/IP protocol and SMI commands to connect to the IO-Link Master to be tested.
Master protocol testing tool

Master physical layer testing tool


Test the physical layer compatibility of the IO-Link Master and support all test cases of the physical layer of the Master in the "IO-Link Test Specification Version 1.1.3".
Master physical layer testing tool

Master EMC testing tool


Test the EMC performance of the IO-Link Master and support all Master EMC test cases in "IO-Link Interface and System Specification Version 1.1.3".
Master EMC testing tool

Device testing tools


Test the protocol compatibility and IODD files of IO-Link Device and support all Device protocol and IODD test cases in the "IO-Link Test Specification Version 1.1.3". Support the test cases in the "IO-Link Common Profile Specification Version 1.1" and the test cases in "IO-Link Profile BLOB Transfer & Firmware Update Specification Version 1.1".
Device testing tools

Device physical layer testing tools


Test the physical layer compatibility of IO-Link Device and support all Device physical layer test cases in the "IO-Link Test Specification Version 1.1.3".
Device physical layer testing tools

Device EMC testing tools


Test the EMC performance of IO-Link Device and support all Device EMC test cases in "IO-Link Interface and System Specification Version 1.1.3".
Device EMC testing tools
证书

2019年

证书

2023年